Breaking the Routing Barrier: HDI PCB Solutions for Fine-Pitch BGA Packages
As semiconductor packaging continues to shrink, fine-pitch ball grid array (BGA) devices have become the standard for processors, FPGAs, GPUs, and high-density memory. A fine-pitch BGA may have ball pitches of 0.8 mm, 0.65 mm, 0.5 mm, or even 0.4 mm, with hundreds or thousands of I/O connections compressed into a small footprint. Traditional through-hole…